Two independent failure mechanisms, mainly induced by temperature, were observed in unpassivated, Au-metallized, commercially available power MESFETs. They result in a high gate/source (drain) leakage and in an increase in the open channel resistance, and may explain the 'burn-out' of the devices in practical applications.
Degradation Mechanisms Induced By Temperature In Power Mesfets
ZANONI, ENRICO
1985
Abstract
Two independent failure mechanisms, mainly induced by temperature, were observed in unpassivated, Au-metallized, commercially available power MESFETs. They result in a high gate/source (drain) leakage and in an increase in the open channel resistance, and may explain the 'burn-out' of the devices in practical applications.File in questo prodotto:
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