In this paper, an emerging double-heterostructure high-electron mobility transistor based on AlN/GaN/AlGaN grown on silicon substrate is presented, which enables a unique simulta- neous achievement of high breakdown voltage and high frequency performance. This configuration system allowed state-of-the-art GaN-on-silicon dc, RF output power, and noise performances at 40 GHz, paving the way for high-performance millimeter-wave (mmW) cost-effective amplifiers. Preliminary reliability assess- ment has been performed on this new class of RF devices, showing promising mmW GaN-on-Si device stability for the first time.

First Reliability Demonstration of Sub-200-nm AlN/GaN-on-Silicon Double-Heterostructure HEMTs for Ka-Band Applications

MENEGHESSO, GAUDENZIO;MENEGHINI, MATTEO;SILVESTRI, RICCARDO;ZANONI, ENRICO
2013

Abstract

In this paper, an emerging double-heterostructure high-electron mobility transistor based on AlN/GaN/AlGaN grown on silicon substrate is presented, which enables a unique simulta- neous achievement of high breakdown voltage and high frequency performance. This configuration system allowed state-of-the-art GaN-on-silicon dc, RF output power, and noise performances at 40 GHz, paving the way for high-performance millimeter-wave (mmW) cost-effective amplifiers. Preliminary reliability assess- ment has been performed on this new class of RF devices, showing promising mmW GaN-on-Si device stability for the first time.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11577/2693278
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