A system for sputtering deposition of thin electromagnetic shields has been developed. A double source magnetron sputtering system, with planar commercial cathodes, has been chosen, in order to realize film depositions in low pressure plasmas with two different targets. A rotating system, with external manual movement, for the location of the sustaining structure of the substrates has been realized, and different vertical positions are obtained by an adjustable fixing of the supporting stem. Finally the system is monitored by a safety system, with interlocks.
Design and realization of a magnetron sputtering device for deposition of electromagnetic shields
DESIDERI, DANIELE;MASCHIO, ALVISE;
2008
Abstract
A system for sputtering deposition of thin electromagnetic shields has been developed. A double source magnetron sputtering system, with planar commercial cathodes, has been chosen, in order to realize film depositions in low pressure plasmas with two different targets. A rotating system, with external manual movement, for the location of the sustaining structure of the substrates has been realized, and different vertical positions are obtained by an adjustable fixing of the supporting stem. Finally the system is monitored by a safety system, with interlocks.File in questo prodotto:
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