The influence of the GaAs surface condition on the properties and thermal stability of WN(x) Schottky diodes on GaAs has been studied by performing in situ H-2 and N2 plasma treatments just before the WN(x) sputter deposition. The WN(x)/GaAs contacts have been investigated by x-ray photoelectron spectroscopy, Rutherford backscattering, nuclear reaction analysis, secondary ion-mass spectroscopy, x-ray diffraction, and transmission electron microscope and correlated to electrical current-voltage and capacitance-voltage measurements. A strong correlation was found between the diode properties and the surface conditions, both for the as-deposited samples and for samples annealed in the range 700-850-degrees-C. Poor rectifying properties were obtained for the plasma-cleaned diodes due to the cumulative effects of plasma cleaning and sputter deposition. After annealing, improved characteristics were generally found. The highest Schottky barrier height values phi-I-V = 0.76 V, which were found for the H-2 plasma treated diodes annealed at 800-degrees-C, were almost independent of the WN(x) composition and sputtering conditions. The H-2 treated samples also showed the smoothest WN(x)/GaAs interface. HCl cleaned and N2 treated surface also showed high-barrier height and small interfacial reactions after high-temperature annealing.
Wnx Schottky Diodes On Plasma Treated Gaas
PACCAGNELLA, ALESSANDRO;CARNERA, ALBERTO;
1991
Abstract
The influence of the GaAs surface condition on the properties and thermal stability of WN(x) Schottky diodes on GaAs has been studied by performing in situ H-2 and N2 plasma treatments just before the WN(x) sputter deposition. The WN(x)/GaAs contacts have been investigated by x-ray photoelectron spectroscopy, Rutherford backscattering, nuclear reaction analysis, secondary ion-mass spectroscopy, x-ray diffraction, and transmission electron microscope and correlated to electrical current-voltage and capacitance-voltage measurements. A strong correlation was found between the diode properties and the surface conditions, both for the as-deposited samples and for samples annealed in the range 700-850-degrees-C. Poor rectifying properties were obtained for the plasma-cleaned diodes due to the cumulative effects of plasma cleaning and sputter deposition. After annealing, improved characteristics were generally found. The highest Schottky barrier height values phi-I-V = 0.76 V, which were found for the H-2 plasma treated diodes annealed at 800-degrees-C, were almost independent of the WN(x) composition and sputtering conditions. The H-2 treated samples also showed the smoothest WN(x)/GaAs interface. HCl cleaned and N2 treated surface also showed high-barrier height and small interfacial reactions after high-temperature annealing.Pubblicazioni consigliate
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