An improvement of the gm ( f) dispersion curve and a decrease in breakdown voltage have been observed in power MESFET’s submitted to accelerated tests. These changes are thermally activated and probably due to thermal annealing of surface states. The activation energy, Ea = 1.0 eV, can be used to evaluate device reliability.

Change of g/sub m/(f) and breakdown voltage induced by thermal annealing of surface states in power MESFETs

PACCAGNELLA, ALESSANDRO;
1990

Abstract

An improvement of the gm ( f) dispersion curve and a decrease in breakdown voltage have been observed in power MESFET’s submitted to accelerated tests. These changes are thermally activated and probably due to thermal annealing of surface states. The activation energy, Ea = 1.0 eV, can be used to evaluate device reliability.
File in questo prodotto:
Non ci sono file associati a questo prodotto.
Pubblicazioni consigliate

I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.

Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11577/3105300
Citazioni
  • ???jsp.display-item.citation.pmc??? ND
  • Scopus 13
  • ???jsp.display-item.citation.isi??? 11
  • OpenAlex ND
social impact