Copper(I) complexes have attracted considerable attention as efficient redox photocatalysts (PCs) in photopolymerization. In this study, two copper(I) complexes bearing a pyridine-benzothiazole ligand were thoroughly investigated as photocatalysts for the free radical photopolymerization of ethoxylated trimethylolpropane triacrylate under violet and green light irradiation. A three-component system comprising a copper complex, di-tert-butyl-diphenyl iodonium hexafluorophosphate, and ethyl dimethylaminobenzoate as additives was investigated under various conditions. The copper complexes exhibited remarkable photoinitiation capabilities, achieving high monomer conversion rates and highlighting significant structure-reactivity relationships. Based on free energy calculations and spectroscopic analyses, a mechanistic pathway was proposed. The optimal conditions were successfully applied in 3D printing, producing smooth and uniform 3D structures.
Heteroleptic Copper(I) Complexes with Pyridine-Benzothiazole Ligands as Photocatalysts for Free Radical Photopolymerization and 3D Printing
Mauro M.
;
2025
Abstract
Copper(I) complexes have attracted considerable attention as efficient redox photocatalysts (PCs) in photopolymerization. In this study, two copper(I) complexes bearing a pyridine-benzothiazole ligand were thoroughly investigated as photocatalysts for the free radical photopolymerization of ethoxylated trimethylolpropane triacrylate under violet and green light irradiation. A three-component system comprising a copper complex, di-tert-butyl-diphenyl iodonium hexafluorophosphate, and ethyl dimethylaminobenzoate as additives was investigated under various conditions. The copper complexes exhibited remarkable photoinitiation capabilities, achieving high monomer conversion rates and highlighting significant structure-reactivity relationships. Based on free energy calculations and spectroscopic analyses, a mechanistic pathway was proposed. The optimal conditions were successfully applied in 3D printing, producing smooth and uniform 3D structures.
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