High gate-current density, which can arise due to RF overdrive, induces two degradation mechanisms in Al-gate power GaAs MESFET's: 1) high current density through the Al-gate finger section causes gate interruption at the beginning of the metal stripe due to electromigration and makes it impossible to reach the pinchoff condition; 2) high current density through the Schottky junction promotes a fast Al/GaAs interaction, causing an increase in the Schottky-barrier height from 0.80 to 0.96 eV owing to the formation of an AlxGa1-xAs interfacial layer. Al/GaAs interaction appears to be enhanced by the electron current at a given temperature.

Degradation Mechanisms Induced By High-current Density In Al-gate GaAs-mesfets

ZANONI, ENRICO
1987

Abstract

High gate-current density, which can arise due to RF overdrive, induces two degradation mechanisms in Al-gate power GaAs MESFET's: 1) high current density through the Al-gate finger section causes gate interruption at the beginning of the metal stripe due to electromigration and makes it impossible to reach the pinchoff condition; 2) high current density through the Schottky junction promotes a fast Al/GaAs interaction, causing an increase in the Schottky-barrier height from 0.80 to 0.96 eV owing to the formation of an AlxGa1-xAs interfacial layer. Al/GaAs interaction appears to be enhanced by the electron current at a given temperature.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11577/2514043
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