CONTI, FOSCA

CONTI, FOSCA  

Dipartimento di Scienze Chimiche - DiSC  

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Risultati 1 - 13 di 13 (tempo di esecuzione: 0.031 secondi).
Titolo Data di pubblicazione Autori Rivista Serie Titolo libro
Hydrogen production from biomass 2023 Conti Fosca + - - European Biomass Conference and Exhibition Proceedings
Genetic engineering of microalgae to increase biodiesel production 2021 Fosca Conti + - - European Biomass Conference and Exhibition Proceedings
Genetic engineering of microalgae to increase biodiesel production 2021 Fosca Conti + - - 29th European Biomass Conference and Exhibition, EUBCE 2021
Highly reliable die-attach bonding with etched brass flakes 2021 Fosca Conti + - - 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste 2021 Fosca Conti + - - Proceedings - Electronic Components and Technology Conference
Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates 2021 Fosca ContiRaffaella SignoriniDanilo Pedron + - - Integrated Optics: Design, Devices, Systems and Applications
Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates 2021 Fosca Conti + - - OPTICAL SENSORS 2021
Simulations and Experiments to Analyze Stress Phenomena in Soldered and Sintered Interconnections between Silicon Nitride chips and Copper Substrates 2021 Fosca Conti + - - 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Copper die bonding using copper formate based pastes with a-terpineol, amino-2-propanol and hexylamine as binders 2020 Fosca Conti + - - 2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)
Development of sinter paste with surface modified copper alloy particles for die-attach bonding 2020 Fosca Conti + - - CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
Finite element simulations and raman measurements to investigate thermomechanical stress in GaN-LEDs 2020 Fosca Conti + - - Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering 2020 Fosca Conti + - - Proceeding of 26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020
Phosphoric acid and its interactions with polybenzimidazole type polymers 2016 CONTI, FOSCA + - - High Temperature Polymer Electrolyte Membrane Fuel Cells - Approaches, Status and Perspectives