With this paper we report a comparison of the performance and reliability of Organic Light-Emitting Diodes (OLEDs) with Indium-Tin Oxide (ITO) and Indium-Zinc Oxide (IZO) anode contact layer. The analysis has been carried out by means of electrical and optical measurements: the devices have been compared in terms of efficiency, thermal resistance and reliability. The results of this analysis indicate that: (i) the use of an IZO anode allows to achieve an efficiency comparable to the case of ITO contacts; (ii) devices with IZO contact have a significantly lower thermal resistance, compared to the ones with ITO anode; (iii) accelerated stress tests show that the OLEDs with IZO anode exhibit an higher reliability. Therefore, the relevant results presented within this work demonstrate that the use of IZO anodes guarantees OLED performance comparable with commercial ITO anode, and allows for a better heat dissipation and devices reliability.

Indium Zinc Oxide as an alternative to Indium Tin Oxide in OLEDs Technology

PINATO, ALESSANDRO;MENEGHINI, MATTEO;TAZZOLI, AUGUSTO;CESTER, ANDREA;WRACHIEN, NICOLA;ZANONI, ENRICO;MENEGHESSO, GAUDENZIO;
2008

Abstract

With this paper we report a comparison of the performance and reliability of Organic Light-Emitting Diodes (OLEDs) with Indium-Tin Oxide (ITO) and Indium-Zinc Oxide (IZO) anode contact layer. The analysis has been carried out by means of electrical and optical measurements: the devices have been compared in terms of efficiency, thermal resistance and reliability. The results of this analysis indicate that: (i) the use of an IZO anode allows to achieve an efficiency comparable to the case of ITO contacts; (ii) devices with IZO contact have a significantly lower thermal resistance, compared to the ones with ITO anode; (iii) accelerated stress tests show that the OLEDs with IZO anode exhibit an higher reliability. Therefore, the relevant results presented within this work demonstrate that the use of IZO anodes guarantees OLED performance comparable with commercial ITO anode, and allows for a better heat dissipation and devices reliability.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11577/2434406
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