This paper report on the long-term stress (1000 h) carried out on AlGaN/GaN HEMTs processed on composite SopSiC substrate. Almost all tested devices present good device stability and promising performance. The reliability issues identified during the work are clearly related to the high levels of gate leakage current. All these results are very encouraging and confirm that the composite substrates are very promising for low-cost and high performance AlGaN/GaN HEMT for RF power applications.

Reliability analysis of AlGaN/GaN HEMT on SopSiC composite substrate under long-term DC-life test

RONCHI, NICOLO';ZANON, FRANCO;STOCCO, ANTONIO;TAZZOLI, AUGUSTO;ZANONI, ENRICO;MENEGHESSO, GAUDENZIO
2009

Abstract

This paper report on the long-term stress (1000 h) carried out on AlGaN/GaN HEMTs processed on composite SopSiC substrate. Almost all tested devices present good device stability and promising performance. The reliability issues identified during the work are clearly related to the high levels of gate leakage current. All these results are very encouraging and confirm that the composite substrates are very promising for low-cost and high performance AlGaN/GaN HEMT for RF power applications.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11577/2440606
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